GB300 High-Performance Liquid-Cooled Heat Sink

Specifically tailored for the next-generation GB300 computing chip.

Product Overview

In the face of the stringent challenges posed by GB300’s ultra-high power consumption and high heat flux density, we have introduced a dedicated liquid-cooling thermal management solution.
By employing a precision microchannel structure, a high-thermal-conductivity pure copper substrate, and an integrated sealing process, this design delivers exceptional cooling performance that is highly efficient, stable, and characterized by low thermal resistance. As a result, the GB300 chip can operate at full clock speeds throughout its entire workload—without frequency throttling, stuttering, or performance degradation.

Core Advantages

- Ultra-high heat dissipation capability
Specifically designed for the GB300 chip, it effortlessly handles ultra-high heat flux densities and maintains stable temperature control under full-load conditions.

- Microchannel high-efficiency heat exchange
Precision flow-channel design significantly enhances heat-transfer efficiency, resulting in more uniform temperatures and more thorough heat dissipation.

- Low flow resistance · Low energy consumption
Optimize fluid flow paths to reduce system pressure loss, ensuring compatibility with high-density clusters and long-term operation.

- Highly reliable sealing structure
Integrated welding process ensures pressure resistance and leak prevention, with no risk of leakage during long-term operation.

- All-copper, high-thermal-conductivity substrate
High-purity thermal-conducting materials are used, resulting in faster heat dissipation, longer service life, and enhanced stability.

- Supports deep customization
Customizable dimensions, interfaces, surface finishes, and flow-path configurations to accommodate various complete-machine and cabinet solutions.

Application Scenarios

- AI supercomputing server

- Intelligent Computing Center / Data Center

- High-density computing cluster

- GB300 Complete Machine Cooling Solution

- Industrial-grade high-performance computing equipment

We offer end-to-end services in professional thermal design, R&D, and manufacturing.
Providing a stable, efficient, reliable, and high-end thermal solution as the cornerstone for cooling computing equipment.