GB200 High-Performance Heat Sink

Customized thermal solution tailored for the GB200 AI accelerator chip

Product Overview

To meet the stringent thermal management requirements of the GB200—characterized by ultra-high power consumption and high heat flux density—we have developed a dedicated high-performance heat sink.
By employing a high-thermal-conductivity substrate and a precision structural design, the device achieves rapid heat conduction, uniform heat dissipation, and stable temperature control, ensuring that the GB200 maintains full performance and output without frequency throttling or degradation even under full-load, long-term operation, thereby continuously delivering robust computing power.

Core Advantages

- Precisely compatible with GB200
Customized based on chip architecture and power consumption characteristics, offering high integration and superior thermal performance.

- High thermal conductivity substrate
High-purity copper or high-thermal-conductivity alloy is selected for rapid heat conduction, low thermal resistance, and more thorough heat dissipation.

- Precision structural design
High-density fin/microchannel structure increases the heat transfer area and enhances overall thermal performance.

- Low aerodynamic drag / low flow resistance
Optimizes airflow and fluid pathways to reduce system load, resulting in quieter operation and improved energy efficiency.

- High strength, long service life
The process is stable and reliable, with excellent oxidation and corrosion resistance, ensuring 24/7 continuous operation.

- Supports customization
Customizable dimensions, thickness, surface finishes, and mounting hole patterns to accommodate various complete-system designs.